A CONNECTION STRUCTURE MANUFACTURING METHOD

A connection structure manufacturing method for obtaining a connection structure in which first and second connection terminals are electrically connected, comprises disposing the second connection terminals (connection terminals of a semiconductor element) facing the first connection terminals (con...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	JUNJI SHINOZAKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A connection structure manufacturing method for obtaining a connection structure in which first and second connection terminals are electrically connected, comprises disposing the second connection terminals (connection terminals of a semiconductor element) facing the first connection terminals (connection terminals of a circuit board) through the agency of a thermosetting anisotropic conductive adhesive (anisotropic conductive film), and pressing the second connection terminals while heating and curing the thermosetting anisotropic conductive adhesive. The pressing rate of the second connection terminals is kept at 50 mm/min or less, and the first and second connection terminals are brought into contact through the agency of the conductive particles in the thermosetting anisotropic conductive adhesive before the viscosity of the thermosetting anisotropic conductive adhesive reaches 10 Pa.s as a result of heating and curing.