Aqueous emulsions of chlorinated polyolefins and epoxy resins, their production, coating compositions thereof and their use

The invention relates to aqueous emulsions of one or more water-dilutable epoxy resins, containing from 10 to 70 % by weight of one or more epoxy resins, from 5 to 50 % by weight of one or more organic solvents having a boiling point of 100 - 160 DEG C, from 10 to 70 % by weight of water, and one or...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	DIENER, WOLFGANG, WINDMANN, REINHARD, OBLOH, RONALD
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to aqueous emulsions of one or more water-dilutable epoxy resins, containing from 10 to 70 % by weight of one or more epoxy resins, from 5 to 50 % by weight of one or more organic solvents having a boiling point of 100 - 160 DEG C, from 10 to 70 % by weight of water, and one or more chlorinated polyolefins in an epoxy resin: chlorinated polyolefin weight ratio of from 10 : 0.5 to 10 : 4.5, where the percentages by weight are each based on the entire aqueous emulsion. The invention also relates to coating compositions which can be prepared using the aqueous emulsions and are used to coat plastic substrates.