Polyamides

A polyamide has incorporated therein from 0,001% to 1,0% by weight of cuprous iodide. The cuprous iodide may be incorporated before or after the manufacture of the polyamide preferably in finely-divided form. The compositions may also contain up to 0,08% by weight of the polyamide of an alkali metal...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	COSTAIN WINSTON, HILL ARTHUR
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBONFILAMENTS CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS,THREADS, FIBRES, BRISTLES OR RIBBONS CHEMISTRY COMPOSITIONS BASED THEREON METALLURGY NATURAL OR ARTIFICIAL THREADS OR FIBRES ORGANIC MACROMOLECULAR COMPOUNDS SPINNING TEXTILES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A polyamide has incorporated therein from 0,001% to 1,0% by weight of cuprous iodide. The cuprous iodide may be incorporated before or after the manufacture of the polyamide preferably in finely-divided form. The compositions may also contain up to 0,08% by weight of the polyamide of an alkali metal iodide, e.g. potassium iodide, delustrants, carbon black or pigments. In the examples, hexamethylene diammonium adipate is polymerized in the presence of acetic acid, anatase, and cuprous iodide and in Example (2) potassium iodide. Specifications 461,236, 461,237 and U.S.A. Specifications 2,071,250, 2,071,253 and 2,130,948 are referred to.