Improvements in or relating to the sealing of electrical components

In a method of seallig electronic components (see Groups XXXVI and XXXVII) a synthetic resin sealant is used which initially is in the form of a solid block but which on heating liquefies and then solidifies and cures. The preferred form of sealant is prepared by melting an epoxy resin, formed as a...

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Bibliographische Detailangaben
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC SWITCHES ELECTRICITY EMERGENCY PROTECTIVE DEVICES PERFORMING OPERATIONS RELAYS RESISTORS SELECTORS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	In a method of seallig electronic components (see Groups XXXVI and XXXVII) a synthetic resin sealant is used which initially is in the form of a solid block but which on heating liquefies and then solidifies and cures. The preferred form of sealant is prepared by melting an epoxy resin, formed as a reaction product of bisphenol A and epichlorhydrin, and mixing in a filler, e.g. slate powder of 200 mesh, and a curing agent, e.g. phthalic anhydride in the proportions of 100 pts. resin to 50 pts. filler and 30 pts. curing agent. The mixture is then cooled and solidifies. The solid is then powdered and pressed to form the sealant block of the required shape. The resulting block is thermoplastic, liquefying at a temperature of 120 DEG -150 DEG C. before beginning to gel and cure.