Control apparatus and control panel

This control apparatus (1000) comprises a main circuit board (40), a first heating element (40a), a second heating element (40b), a structure (ST), a first heat dissipation sheet (41), and a second heat dissipation sheet (23). The first heating element (40a) is mounted to a front surface (FS) of the...

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Bibliographische Detailangaben
Hauptverfasser:	Tomoki Okuno, Takahiro Yamada, Masakazu Taketomi, Kenichiro Okura
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	This control apparatus (1000) comprises a main circuit board (40), a first heating element (40a), a second heating element (40b), a structure (ST), a first heat dissipation sheet (41), and a second heat dissipation sheet (23). The first heating element (40a) is mounted to a front surface (FS) of the main circuit board (40). The second heating element (40b) is mounted to a rear surface (RS) of the main circuit board (40). The structure (ST) has a first protruding part (42a) and a second protruding part (20a). The first heat dissipation sheet (41) is sandwiched between the first heating element (40a) and the first protruding part (42a). The second heat dissipation sheet (23) is sandwiched between the second heating element (40b) and the second protruding part (20a). The first heat dissipation sheet (41) is in contact with the first heating element (40a) and the first protruding part (42a). The second heat dissipation sheet (23) is in contact with the second heating element (40b) and the second protruding part (20a).