Electroforming method and system

Electroforming method and system

An electroforming system 101 and method as defined where the method includes the co-deposition of both metallic ions 125 and powder 130 from a solution 112/113 on the surface of the cathode 116. Through the application of a voltage to the electrodes 114,116 a layer with the particles 130 incorporate...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Lakshmi Krishnan, Sachin Nalawade, Karthick Gourishankar, Vishwanath T, Ramkumar Oruganti, Raghavendra Adharapurapu, Sanjay Kumar Sondhi
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An electroforming system 101 and method as defined where the method includes the co-deposition of both metallic ions 125 and powder 130 from a solution 112/113 on the surface of the cathode 116. Through the application of a voltage to the electrodes 114,116 a layer with the particles 130 incorporated in a metal matrix is deposited. The metallic powder has an average particle size of 0.1-100 micrometers. The electroformed component is then heat treated in a temperature range of 600-100oC. A composite layer may thus be formed through electroforming. The powder may be metallic or comprise fibres such as carbon nanotubes, graphene, silica, titanium.