Integrated circuits with embedded layers

An integrated circuit (IC) comprising a first set of circuit layers 102a on a semiconductor substrate 101, magnetic layer portions forming a magnetic component on the first set of circuit layers, and a second set of circuit layers 102b on the first set of circuit layers and magnetic layer portions....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Aleksey Khenkin, David Patten
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDUCTANCES MAGNETS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SEMICONDUCTOR DEVICES TRANSFORMERS
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Beschreibung
Zusammenfassung:	An integrated circuit (IC) comprising a first set of circuit layers 102a on a semiconductor substrate 101, magnetic layer portions forming a magnetic component on the first set of circuit layers, and a second set of circuit layers 102b on the first set of circuit layers and magnetic layer portions. The magnetic layer portions comprise a magnetic layer 203 coupled to the first set of circuit layers by an adhesion layer 204. The magnetic component comprises a stack of magnetic layer portions. Each of the magnetic layer portions has an edge sidewall perpendicular to a plane of the magnetic layer portion. The magnetic layer portions may form a magnetic component with a toroidal shape. The first set of circuit layers may form a set of lower windings for an inductor or transformer and the second set of circuit layers may form a set of upper windings for the inductor.