Multicomponent module design and fabrication

Multicomponent module assembly by identifying a failed site on a laminate comprising a plurality of sites, adding a machine discernible mark associated with the failed site, placing an electrically good element at a successful site; and providing an MCM comprising the laminate, and the electrically...

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Bibliographische Detailangaben
Hauptverfasser: Stephanie Allard, Brian W Quinlan, David Edward Turnbull, Jean Labonte, Jon Alfred Casey, Sungjun Chun, Kirk D Peterson, Daniel M Dreps, Steven Paul Ostrander, Denis Blanchard, Sylvain Pharand, Pascale Gagnon, Charles L Reynolds, Jean-Francois Bachand
Format: Patent
Sprache:eng
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Zusammenfassung:Multicomponent module assembly by identifying a failed site on a laminate comprising a plurality of sites, adding a machine discernible mark associated with the failed site, placing an electrically good element at a successful site; and providing an MCM comprising the laminate, and the electrically good element.