Glue device for bonding assembling seams of segmental girder and application method

The device comprises a grouting shell 2 corresponding to a matching surface of the segmental girder 1 and a grouting structure 3 in communication with the grouting shell, an edge of the grouting shell abutting against an edge of the segmental girder, an inner wall of the grouting shell and the match...

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Bibliographische Detailangaben
Hauptverfasser: Zhijian Wang, Qingpei Ding, Qi Peng, Fan He, Fei Guo, Yongguang Chen, Wenqiang Zheng, Wei Qin, Jiawei Yang, Zhouyu Xie, Xiao Zhou, Xiaofeng Deng, Jianming Tang, Gaofei Wei, Zichuang Fu, Beibei Cheng, Guosheng Wang
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The device comprises a grouting shell 2 corresponding to a matching surface of the segmental girder 1 and a grouting structure 3 in communication with the grouting shell, an edge of the grouting shell abutting against an edge of the segmental girder, an inner wall of the grouting shell and the matching surface of the segmental girder together forming a closed grouting chamber, and the grouting structure being used for injecting bonding liquid into the grouting chamber and covering the matching surface of the segmental girder. The inner wall of the grouting shell may comprise a closing member 21 and the closing member closes a pre-stressed duct 11 and an inserting groove 12 at the matching surface of the segmental girder. The grouting structure may further comprise a support plate 32, telescopic drive piece 35 on both sides of the support plate. Also disclosed is a method of implementing the glue device.