A method of fitting a cooling device to a circuit board and a circuit board cooling device
A method of fitting a cooling device 2 to a circuit board 3 is described for cooling a high-power electronic component 4 mounted on the circuit board. The method provides the cooling device with a cooling surface 17D having a cooling area for thermally connecting to a to be cooled surface 7 of the e...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A method of fitting a cooling device 2 to a circuit board 3 is described for cooling a high-power electronic component 4 mounted on the circuit board. The method provides the cooling device with a cooling surface 17D having a cooling area for thermally connecting to a to be cooled surface 7 of the electronic component. Fixing elements (eg screws) 20 are provided for moving the cooling surface towards the circuit board. A distance position d of the to be cooled surface from the circuit board is determined and on this basis spacer elements 22 are selected to be interposed between the cooling device and the circuit board to limit the movement by the fixing elements to a position where the cooling area is in close proximity to the to be cooled surface 7. |
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