Configurable heatsink

One or more computer processors 206 are connected by a flexible heat conduit 208 to a heatsink 202 such that a position of the heatsink is adjustable, to aid in the cooling of the processor(s). The heatsink may be angularly, horizontally or vertically adjusted with respect to the plane of the surfac...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Michael L. Sabotta, Reza Azizian, Susheela N. Narasimhan, Herman W. Chu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	One or more computer processors 206 are connected by a flexible heat conduit 208 to a heatsink 202 such that a position of the heatsink is adjustable, to aid in the cooling of the processor(s). The heatsink may be angularly, horizontally or vertically adjusted with respect to the plane of the surface on which the processor(s) are mounted. The system may comprise a graphics card with the processor(s) comprising graphics processing unit(s), and the flexible heat conduit may comprise a loop siphon. A mounting device may be provided, comprising one or more attachment points that permit the position of the heatsink to be adjusted.