Systems and methods for additive manufacturing of electronics

Three methods are provided that can directly apply a required conductive pattern on a substrate prior to reflow soldering of pick-and-place components. A first method (fig 5a,b) deposits a conductive ink and once cured, reduces the ink by a plasma treatment; Then solder is deposited on a portion of the reduced ink, components are placed on the solder and the assembly is reflow soldered by heating such that the solder and reduced conductive ink to form an intermetallic compound therebetween. A second method (fig 6a,b) deposits a conductive ink and on top of that a thin film of silver; Co-curing the ink and silver is done prior to depositing solder and then reflow soldering components giving an intermetallic compound. The third method (fig 7a,b) deposits a conductive ink, at most partly curing the ink prior to deposition of solder and reflow soldering components giving an intermetallic compound.