Systems and methods for bonding a downhole tool to a borehole tubular

A method for bonding a first downhole tool to a borehole tubular. The method may include applying solder particles, each particle having an outer shell and a core of liquid metal, to at least one of a surface of the first downhole tool or a surface of the borehole tubular. The method may also includ...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Frank Acosta, Lonnie Helms, Sam Lewis, William Cecil Jr. Pearl
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method for bonding a first downhole tool to a borehole tubular. The method may include applying solder particles, each particle having an outer shell and a core of liquid metal, to at least one of a surface of the first downhole tool or a surface of the borehole tubular. The method may also include rupturing the shells of the solder particles to release the liquid metal cores. The method may further include bonding the first downhole tool to the borehole tubular by allowing the released liquid metal core to solidify.