Carrier release
Method comprising providing an assembly, adhered temporarily on opposite sides to carriers 16 by adhesive elements 14c, the assembly include at least one plastic support sheet, the assembly including at least one plastic support sheet; and heating said assembly to completely cure another adhesive in...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | Method comprising providing an assembly, adhered temporarily on opposite sides to carriers 16 by adhesive elements 14c, the assembly include at least one plastic support sheet, the assembly including at least one plastic support sheet; and heating said assembly to completely cure another adhesive included within said assembly, wherein an adhesion strength of the adhesive element to at least one of the adjacent carrier and assembly is partially reduced during said heating, and is further reducible by further heating after completely curing said adhesive included within said assembly. The adhesion strength of the adhesive element to at least one of the adjacent carrier assembly may be further reducible by first cooling and then further heating after completely curing said another adhesive included within said assembly. After said heating while compressing the assembly, cooling the assembly before partially or completely relaxing the pressure at which the assembly is compressed. |
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