Electronic device having thermal spreading through a hinge of a configurable housing that supports a front flexible display

An electronic device, a communication device, and a method enhance thermal energy spreading via thermal spreader layer(s) of a flexible layer assembly extending through a hinge coupling first and second device housings of a configurable housing assembly. The thermal spreader layer is positioned on a surface of a flexible circuit of the flexible layer assembly. The thermal spreader layer has one end thermally coupled to a first structure within the first device housing and another end thermally coupled to a second structure within the second device housing to transfer thermal energy between the first and the second structures. The flexible layer assembly deforms within one or both of a first and second chamber respectively of the first and second device housings when the first and second device housings pivot about the hinge from a closed position to an axially displaced open position.