Structure with controlled capillary coverage

A structure(101) with controlled capillary coverage is provided and includes a substrate(110) including one or more first contacts(112), a component(130) and adhesive(140). The component(130) includes one or more second contacts(132) and a rib(133) disposed at a distance from each of the one or more...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Thomas Lombardi, Kevin Drummond, Stephanie Allard, Catherine Dufort, Steve Ostrander
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A structure(101) with controlled capillary coverage is provided and includes a substrate(110) including one or more first contacts(112), a component(130) and adhesive(140). The component(130) includes one or more second contacts(132) and a rib(133) disposed at a distance from each of the one or more second contacts(132). The component(130) is disposed such that the one or more second contacts(132) are communicative with the one or more first contacts(112) and corresponding surfaces of the substrate(110) and the rib(133) face each other at a controlled gap height to define a fill-space(150). The adhesive(140) is dispensed at a discrete point(141) whereby the adhesive(140) is drawn to fill the fill-space(150) by capillary action.