High power device fault localization via die surface contouring

A method of preparing a computer processor die comprising determining warpage shape of the die at a testing temperature and from this, contouring a thickness of the die at a contouring temperature by physically removing material from a surface of the die such that said surface will be substantially flat at the testing temperature. The surface is contacted with a cooling plate. The testing temperature may lie within 10°C of the operating temperature of the die. Finite element analysis may be used iteratively to determine the contouring that should be performed for the surface of the die to be substantially flat. Another method is provided comprising: heating the die to an initial temperature, attaching the die to a shaping material to maintain the shape at said temperature, contouring a thickness of the die and separating the die from the shaping material. Said shaping material may be wax and may be poured between a stud and the die and allowed to solidify, dry and/or cure.