Hybrid epoxy composition

A curable composition comprises a curable epoxy component, a heat-activated curing agent, 10-15 wt.% phenol-terminated polyurethane component, and 10-15 wt.% (meth)acrylate component. When cured, the composition has an elastic modulus of 300-900 MPa and a tensile lap shear strength >20 MPa. The weight ratio of the polyurethane and (meth)acrylate components is preferably 1:1. The epoxy component may be present in an amount of 20-80 wt.%, particularly 35-65 wt.%. The curing agent may be present in an amount of 0.25-2.0 wt.% and may be activatable at 150-200ºC. Typically, the curing agent is a urea, e.g. 1,1'-(4-methyl-m-phenylene)bis(3,3'-dimethylurea). The (meth)acrylate component may be an epoxy (meth)acrylate, urethane (meth)acrylate, ester (meth)acrylate, or melamine (meth)acrylate. Preferably, the composition is free from peroxide. A method of bonding a joint between male and female mating parts using the composition is disclosed, wherein the difference between the thermal expansion coefficients of the male and female parts is preferably >5x10-6 m/m.ºC.