Co-packaged optics and transceiver

Co-packaged optics and transceiver

An assembly. In some embodiments, the assembly includes: a photonic integrated circuit (PIC, 105); and an electronic integrated circuit (IC, 110). A front surface of the photonic integrated circuit abuts, in an area of overlap (135), against a front surface of the electronic integrated circuit. A fi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SeungJae Lee, David Arlo Nelson, Brett Sawyer
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An assembly. In some embodiments, the assembly includes: a photonic integrated circuit (PIC, 105); and an electronic integrated circuit (IC, 110). A front surface of the photonic integrated circuit abuts, in an area of overlap (135), against a front surface of the electronic integrated circuit. A first portion (125) of the photonic integrated circuit overhangs a first edge (130) of the electronic integrated circuit, and a first portion (115) of the electronic integrated circuit overhangs a first edge (120) of the photonic integrated circuit. A conductor on the front surface of the electronic integrated circuit is connected, in the area of overlap, to a conductor on the front surface of the photonic integrated circuit.