Devices and methods related to radio-frequency filters on silicon-on-insulator substrate
A radio-frequency (RF) module comprises a wafer level chip scale package (WLCSP) mounted on a packaging substrate 172. The WLCSP has a silicon die 104 that includes a RF circuit 160 implemented at or near a first side of the die, mounting features 168 on the second side of the die, and a plurality o...
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Zusammenfassung: | A radio-frequency (RF) module comprises a wafer level chip scale package (WLCSP) mounted on a packaging substrate 172. The WLCSP has a silicon die 104 that includes a RF circuit 160 implemented at or near a first side of the die, mounting features 168 on the second side of the die, and a plurality of vias 108 connecting the first and second sides of the die. The WLCSP also has at least one RF flip chip 102 including a filter circuit mounted on the first side of the silicon die, in communication with the RF circuit. The lateral area of the WLCSP is less than 20% of the lateral area of a package where a similar silicon die and a similar number of RF flip chips are mounted next to each other on a packaging substrate. The RF module can be included in a wireless device to route a radio signal received by an antenna to a receiver. |
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