Electro-optical package and method of fabrication

Electro-optical package and method of fabrication

An assembly. In some embodiments, the assembly includes: a photonic integrated circuit; and an electronic integrated circuit. A front surface of the photonic integrated circuit abuts, in an area of overlap, against a front surface of the electronic integrated circuit. A first portion of the photonic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Karlheinz Muth, Vivek Raghunathan, Vivek Raghuraman
Format: Patent
Sprache:eng
Schlagworte:
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Beschreibung
Zusammenfassung:An assembly. In some embodiments, the assembly includes: a photonic integrated circuit; and an electronic integrated circuit. A front surface of the photonic integrated circuit abuts, in an area of overlap, against a front surface of the electronic integrated circuit. A first portion of the photonic integrated circuit overhangs a first edge of the electronic integrated circuit, and a first portion of the electronic integrated circuit overhangs a first edge of the photonic integrated circuit. A conductor on the front surface of the electronic integrated circuit is connected, in the area of overlap, to a conductor on the front surface of the photonic integrated circuit.