Composition, paste and methods

A composition for sealing inorganic substrates is disclosed, the composition comprising a glass frit and a filler material, wherein said glass frit comprises: 60 to 85 wt% Bi2O3; 3 to 15 wt% ZnO; 2 to 10 wt% B2O3; 0.5 to 5 wt% SiO2; 0.5 to 5 wt% Al2O3; and 0.1 to 0.5 wt% of a compound selected from...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Svetlana N. Emelianova, Maxence Valla, Hong Ren, Edwin Peter Kennedy Currie
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A composition for sealing inorganic substrates is disclosed, the composition comprising a glass frit and a filler material, wherein said glass frit comprises: 60 to 85 wt% Bi2O3; 3 to 15 wt% ZnO; 2 to 10 wt% B2O3; 0.5 to 5 wt% SiO2; 0.5 to 5 wt% Al2O3; and 0.1 to 0.5 wt% of a compound selected from NaF and BaF2. The composition may include a laser absorber. Also disclosed is a method of using the composition to form a bond or seal between inorganic substrates such as glass or metal. The method may use convective or radiative heating. The heat may be supplied by use of a laser. The method may be used to form a vacuum insulated glass unit.