A method of bonding polyolefin substrates

A method of bonding a first polyolefin substrate to a second substrate comprising the steps of: (a) providing an amount of an exothermically curable composition which generates an exotherm of at least 65°C desirably at least 70°C, within 15 seconds and desirably within 10 seconds; (b) creating an as...

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Bibliographische Detailangaben
Hauptverfasser: Brian Deegan, Brendan J Kneafsey
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method of bonding a first polyolefin substrate to a second substrate comprising the steps of: (a) providing an amount of an exothermically curable composition which generates an exotherm of at least 65°C desirably at least 70°C, within 15 seconds and desirably within 10 seconds; (b) creating an assembly comprising the first polyolefin substrate and the second substrate with the amount of the exothermically curable composition positioned in a bond area between the substrates; (c) curing the amount of the exothermically curable composition to generate an exotherm of at least 65°C desirably at least 70°C, within 15 seconds and desirably within 10 seconds; so that the exothermically curable composition bonds to the polyolefin due to softening of the polyolefin within the bond area as a result of the exotherm. The polyolefins are selected from polyethylene, polypropylene, polybutylene, polymethylepentene, polyisobutylene and ethylene containing rubbers. Most preferably the polyolefins to be bonded are polyethylene or polybutylene or blends thereof.