Semiconductor structures

A semiconductor wafer 80' is provided which may be diced into a plurality of primary die 800. A primary die 800 comprises at least one aperture 801 extending through the primary die 800 from an upper surface of the primary die 800 to a lower surface of the primary die 800, wherein each aperture...

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Bibliographische Detailangaben
Hauptverfasser:	Roberto Brioschi, Rkia Achehboune
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A semiconductor wafer 80' is provided which may be diced into a plurality of primary die 800. A primary die 800 comprises at least one aperture 801 extending through the primary die 800 from an upper surface of the primary die 800 to a lower surface of the primary die 800, wherein each aperture 801 is suitable for receiving a secondary die 850. The wafer 80' may be provided on a carrier layer 830 which serves to support the wafer 80' in the region of the opening 801 whilst a secondary die 850 is positioned within the aperture 801. The secondary die 850 may be secured within the hole 801 using moulding material. A micro-electro-mechanical (MEMS) transducer 802 may be provided on the primary die 800, the microelectromechanical transducer 802 being a microphone. The secondary die 850 may comprise a transducer die or a circuitry die.