Printed circuit board and electronic device

A printed circuit board and an electronic component assembly includes a first electronic component land 130, a printed wiring board including a solder resist portion 240 and a second PWB land 230, and a connecting portion interconnecting the first land and the second land. An opening 550 larger than the first land in plan view from the electronic component side is defined in the resist portion. In plan view from the electronic component side, the first land is disposed inside the opening, the second land including a body portion disposed inside the opening and a protruding portion extending radially from the body portion. The body portion of the second land is disposed inside than an outer edge of the first land in plan view. At least part of the protruding portion protruding beyond an outside edge of the first land. The bond pad/land arrangement facilitates X-ray monitoring of BGA connections formed between imaging chips and PCB carrier substrates.