A joined article, a method of de-bonding an article and a method of curing a binder

There is disclosed a joined article 10 comprising opposing substrates 12, a binder 14 between the substrates 12 binding the substrates 12 together and a de-bonding membrane 20 embedded within the binder 14 and configured to selectively expand to enable de-bonding of the substrates 12. The de-bonding...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Dharun Vadugappatty Srinivasan, Wu Xin Charles Ng
Format: Patent
Sprache:eng
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Zusammenfassung:There is disclosed a joined article 10 comprising opposing substrates 12, a binder 14 between the substrates 12 binding the substrates 12 together and a de-bonding membrane 20 embedded within the binder 14 and configured to selectively expand to enable de-bonding of the substrates 12. The de-bonding membrane 20 comprises a carrier 22 comprising nano-fibres, wherein the carrier 22 is impregnated with an expandable agent 24 which expands in response to heating. Preferably, the nano-fibre is comprised of a single or plurality of electro-spun nano-fibres. Preferably the expanding agent comprises graphite There is also disclosed a method of de-bonding a joined article 10 comprising opposing substrates 12, a binder 14 between the opposing substrates 12 and a de-bonding membrane 20 embedded within the binder 14 having a carrier 22 impregnated with an expandable agent 24. Preferably, the carrier is heat by inducing current into the carrier. The method comprises heating the carrier 22 such that the expandable agent 24 expands and de-bonds the opposing substrates 12. There is further disclosed a method of curing an adhesive 14, 114 comprising embedding a membrane 20, 120 in an adhesive 14, 114 and heating the membrane 20, 120 so that heat transfers from the membrane 20, 120 to the adhesive 14, 114 to cure the adhesive 14, 114.