Optoelectronic module package

An optoelectronic module, comprising: a substrate 130 featuring a flange (pocket); conductive traces 137; a digital integrated circuit (IC) 125; and a thermal conductive frame 145, secured in the flange. The substrate may comprise a copper layer 170. The module may comprise a photonic 105 and analogue 115 ICs. A carrier 155 may be secured to an upper surface of the frame and support the photonic and analog ICs. The carrier may comprise: an insulating layer and a plurality of thermal paths 160 between the analog IC and frame. A heater 165 may be provided: on, or in, the photonic IC; or as patterned metal traces on the carrier. An optical fibre 110 may be received by a V-groove in the photonic IC. A thermally conductive lid 140 may enclose the optoelectronic module and act as a heat sink 135. A second aspect discloses, an optoelectronic module, comprising: a substrate (130, Fig. 9) comprising an insulating layer and a flange with a copper layer (170, Fig. 9); an electronic (digital) IC (905, Fig. 9); and a photonic IC (105, Fig. 9) secured to the copper layer.