Integrated circuit structure

A metal interconnect comprising cobalt and method of forming a metal interconnect comprising cobalt are described. In an embodiment, a metal interconnect comprising cobalt includes a dielectric layer disposed on a substrate, an opening formed in the dielectric layer such that the substrate is expose...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Christopher J Jezewski, Tejaswi K Indukuri, Florian Gstrein, James S Clarke, Daniel J Zierath
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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