MEMS Sensors with selectively adjusted damping of suspension

A micro-electro-mechanical systems (MEMS) device and method of fabricating the MEMS device are disclosed. The MEMS device comprises a substrate, one or more suspension structures connected to the substrate, one or more metallized layers on the one or more suspension structures, and one or more sense structures connected to the one or more suspension structures. The one or more metallized layers provide selectively adjusted damping of the one or more suspension structures. The metallized layers may comprise platinum, titanium, zinc, aluminum, copper, nickel, silver, gold, chromium or molybdenum and have a thickness ratio with respect to the suspension structures between 1:100 and 1:10. The MEMS device may further comprise a gyroscope or an accelerometer. The MEMS device may be included within a MEMS inertial structure together with a getter structure adjacent to the at least one MEMS inertial sensor; and a set of bond pads electrically connected to the at least one MEMS inertial sensor. The MEMS package may further include a first gyroscope that is operated in a mode-match configuration with a lower bandwidth and a higher sensitivity and a second gyroscope without one or more metallized layers for adjusted damping, the second gyroscope operated in a split mode with a higher bandwidth and a lower sensitivity. Alternatively the MEMS package may include an accelerometer and a gyroscope without one or more metallized layers for adjusted damping.