Chip scale LED packaging method

A chip scale LED packaging method having the following steps: clamping an upper mould 10, with a plurality of through holes 11, to a plate-shaped lower mould 20; allowing the bottoms of the through holes of the upper mould to be sealed by the lower mould; placing chips 30 one by one into each sealed through hole; pouring encapsulation gel 40 into each sealed through hole; curing the encapsulation gel; separating the upper mould from the lower mould; and separating the encapsulated chips from the through holes of the upper mold. In this manner, a number of individual chip scale LED packages are obtained. The encapsulated chips may be removed from the upper mould with a blanking die 70. The blanking die pushes the encapsulated chips out of the through holes in the upper mould, as shown in figure 14.