Engine integration of power electronics system

A power electronics unit 10, an engine 102 and a radiator 110 form a cooling circuit 200. The power electronics unit 10 may have a cooling element (50, figure 3) coupled to a back wall or a side wall, with an inlet to receive a working fluid coolant from a radiator 110, to thermally regulate electro...

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Bibliographische Detailangaben
Hauptverfasser:	Jaroslaw Leonarski, Johnny Chung-Yin Tsai, Vivek A. Sujan, William Brent Fields, Eric L Piper, Haomin Wang
Format:	Patent
Sprache:	eng
Schlagworte:	ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS INVEHICLES ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OFTRANSMISSIONS IN VEHICLES ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GASEXHAUST OR FUEL SUPPLY OF PROPULSION UNITS, IN VEHICLES AUXILIARY DRIVES FOR VEHICLES BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COOLING OF INTERNAL-COMBUSTION ENGINES COOLING OF MACHINES OR ENGINES IN GENERAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINE PLANTS IN GENERAL HEATING INSTRUMENTATION OR DASHBOARDS FOR VEHICLES LIGHTING MACHINES OR ENGINES IN GENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PERFORMING OPERATIONS PRINTED CIRCUITS STEAM ENGINES TRANSPORTING VEHICLES IN GENERAL WEAPONS
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Beschreibung
Zusammenfassung:	A power electronics unit 10, an engine 102 and a radiator 110 form a cooling circuit 200. The power electronics unit 10 may have a cooling element (50, figure 3) coupled to a back wall or a side wall, with an inlet to receive a working fluid coolant from a radiator 110, to thermally regulate electronic components in the unit 10. An outlet of the cooling device directs the working fluid to the engine 102. A conduit 230 may be coupled between the engine 102 and the radiator 110 to return the working fluid to the radiator 110. The cooling element may be positioned within a wall of a housing of the power electronics unit 10. A copper layer or standoff in power electronics unit 10 may conduct heat from the electrical components to the working fluid, reducing hot spots. A silicon pad or thermally conductive bracket may be provided.