Packaging

Packaging (10) with an integrated electronics module (figure 2, 24) is described together with a method for forming said packaging. The method comprises providing a planar packaging blank (Figure 1a,11) of foldable material where the blank is configured to permit assembly into packaging (10) which a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Gerhard Klink, Johan-Dieter Hemmetzberger, Douglas Hutt
Format: Patent
Sprache:eng
Schlagworte:
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