Packaging

Packaging (10) with an integrated electronics module (figure 2, 24) is described together with a method for forming said packaging. The method comprises providing a planar packaging blank (Figure 1a,11) of foldable material where the blank is configured to permit assembly into packaging (10) which a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Gerhard Klink, Johan-Dieter Hemmetzberger, Douglas Hutt
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Packaging (10) with an integrated electronics module (figure 2, 24) is described together with a method for forming said packaging. The method comprises providing a planar packaging blank (Figure 1a,11) of foldable material where the blank is configured to permit assembly into packaging (10) which accommodates one or more products (12). A flexible electronics module is provided, said module comprising one or more temperature measurement devices for measuring a temperature of at least one of said products and a temperature display (18) configured to display the temperature of said product(s). The positioning of said electronics module with respect to said packaging is such that both can be folded together to form the assembled packaging (10). The packaging (10) is foldable from a first unassembled state to a second assembled state to enable one or more of said products to be accommodated. The electronics module (figure 2,24) or part of said module may be laminated on to the packaging using an adhesive film. The module, or part of said module may be printed on the packaging and the module may also comprise a foil or film comprising one or more printed electronic components; the module can also comprise a power source with activation (20) of touch sensitive button (22) to initiate or display (18) temperature measurement.