Methods and circuits

Disclosed are methods of forming connection targets 101 for customisable integrated circuits (lCs) providing for selective interconnection of conductive tracks to interconnect devices and/or external terminals of the ICs by deposition of conductive dots 80, for instance by printing, onto the targets. Customisable and customised ICs having the connection targets are also provided, asare methods for their formation and use. The connection targets are formed of an aperture 70 in an insulating layer between first and second conductive tracks 20, 40, with a gap in the second track, at the aperture, providing an open circuit between the first and second conductive tracks which may be closed by depositing a conductive dot 80 onto the connection target to conductively bridge the gap.