Method for manufacturing LED devices

A method for manufacturing LED devices from multiple LED dies 14 mounted on a substrate comprises the steps of positioning a reflector-printing stencil 32 over the substrate 12 such that a plurality of apertures 34 in the reflector-printing stencil corresponds to gaps between adjacent LED dice positioned on the substrate. Thereafter, a reflector material 38 is printed onto the substrate through the plurality of apertures of the reflector-printing stencil into the gaps between the adjacent LED dice. A layer of phosphor material may be deposited by another printing step wherein the phosphor coating to the LEDs may be applied through a phosphor printing stencil. The stencil may feature a number of setbacks to protect the LED whilst the coating is being applied. The reflector material may be pushed across the reflector printing stencil with a squeegee similar to screen printing. A shim maybe positioned on the substrate prior to the stencil being positioned.