Packaging for MEMS transducers

This application describes methods and apparatus relating to packaging of MEMS transducers and to MEMS transducer packages. The application describes a MEMS transducer package (300) having a first integrated circuit die (200) which has an integrated MEMS transducer (202) and integrated electronic ci...

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Bibliographische Detailangaben
1. Verfasser:	Tsjerk Hoekstra
Format:	Patent
Sprache:	eng
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PUBLIC ADDRESS SYSTEMS TRANSPORTING
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Beschreibung
Zusammenfassung:	This application describes methods and apparatus relating to packaging of MEMS transducers and to MEMS transducer packages. The application describes a MEMS transducer package (300) having a first integrated circuit die (200) which has an integrated MEMS transducer (202) and integrated electronic circuitry (203) for operation of the MEMS transducer. The package is arranged such that the footprint of the MEMS transducer package is substantially the same size as the footprint of the integrated circuit die. At least part of the first integrated circuit die (200) may form a sidewall of the package. The package may be formed by a first package cover (302) which overlies the MEMS transducer and a second package cover (301) on the other side of the first integrated circuit die.