A method for joining at least two components of an endoscope, component of an endoscope and endoscope

In a method according to the invention for connecting at least two components 7, 2, of an endoscope, at least one solder mold part 18, which contains a high-temperature solder, is brought into at least one solder reservoir of at least one of the components, the at least two components are held to on...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Andreas Deutschendorf, Siegfried Hofig, Steffen Brusehaber
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIAGNOSIS HUMAN NECESSITIES HYGIENE IDENTIFICATION MACHINE TOOLS MEDICAL OR VETERINARY SCIENCE METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING SURGERY TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	In a method according to the invention for connecting at least two components 7, 2, of an endoscope, at least one solder mold part 18, which contains a high-temperature solder, is brought into at least one solder reservoir of at least one of the components, the at least two components are held to one another such that, between joining regions, which are assigned to one another, of the at least two components, there is formed at least one soldering gap which is in capillary connection with the at least one solder reservoir 15, 16, 17, and the arrangement (1, 22) made up of the at least two components and the at least one solder mold part 18 is heated to a soldering temperature of the high-temperature solder. The invention also relates to a component of an endoscope and to an endoscope.