LED (LIGHT-EMITTING DIODE) ENCAPSULATION AND MANUFACTURING METHOD THEREOF

The present invention provides an LED encapsulation and a manufacturing method thereof. The LED encapsulation includes: a first frame (10), a plurality of LED elements (20), encapsulant (30), and the quantum dot rail (40). The first frame (10) includes a PCB (12) and four sidewalls (14). The four si...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Chien Chang, Yongyuan Qiu, Zanjia Su, Chih-tsung Kang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention provides an LED encapsulation and a manufacturing method thereof. The LED encapsulation includes: a first frame (10), a plurality of LED elements (20), encapsulant (30), and the quantum dot rail (40). The first frame (10) includes a PCB (12) and four sidewalls (14). The four sidewalls (14) surround and circumferentially delimit an accommodation space (18). The plurality of LED elements (20) is mounted on the PCB (12) and in electrical connection therewith. The encapsulant (30) is filled in the accommodation space (18). The four sidewalls (14) each have a top end portion forming a mounting section (16). The quantum dot rail (40) is mounted in the mounting sections (16) so that the quantum dot rail (40) is located above the encapsulant (30). The first frame (10), the plurality of LED elements (20), and the quantum dot rail (40) are collectively and integrally encapsulated so as to be fixedly assembled together.