An apparatus and a method for cooling electronic devices

The present invention provides an apparatus, and a method for cooling an electronic device that may be used in densely packed data storage systems. The apparatus 1 comprises at least one pair of heat conducting plates 12a, 12b. The plates 12a, 12b are movable between a first configuration in which they are not in engagement with an electronic device (100) and a second configuration in which they are in engagement with the electronic device. A biasing mechanism is actuatable to move the at least one pair of plates 12a, 12b from the first configuration to the second configuration. The plates 12a, 12b may be connected to a base plate portion 14 and resiliently angled apart to form a tapered well 16 in which to accommodate the electronic device (100). The biasing mechanism may be actuated to urge the heat conducting plates 12a, 12b to flex at the base portion 14 to sandwich the electronic device (100). The biasing mechanism may comprise a separator 20 having one or more protrusions 20a to urge adjacent heat conducting plates 12a, 12b to contact adjacent electronic devices (100).