Sensor package with wire bondable chip capacitors

A ceramic chip capacitor 100 with a terminal layer 116, 118 comprising nickel and a protective layer 126, 128 comprising palladium or gold. In one embodiment the chip can be electrically connected to remotely-located nodes using fine wires made of aluminium or gold. In one embodiment the palladium protective layer is covered by a thin layer of gold. The chip can be placed within the housing of a pressure sensor adjacent a microelectromechanical system (MEMS) with the wires connecting the chip to a lead frame leading to the outside of the housing. A method is also included for forming a pressure sensor comprising applying a liquid adhesive to a substrate, placing a chip capacitor on the liquid adhesive and wire bonding a wire to the chip.