Apparatus and method for memory operation bonding

A processor is configured to evaluate memory operation bonding criteria to selectively identify memory operation bonding opportunities within a memory access plan. Memory operations are combined in response to the memory operation bonding opportunities to form a revised memory access plan with accel...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: RANGANATHAN SUDHAKAR
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A processor is configured to evaluate memory operation bonding criteria to selectively identify memory operation bonding opportunities within a memory access plan. Memory operations are combined in response to the memory operation bonding opportunities to form a revised memory access plan with accelerated memory access.