Heatsink attachment module

An assembly process for a heatsink attachment module for a chip packaging apparatus is provided and includes attaching a semiconductor chip to a substrate to form a module subassembly, placing a load frame and shim in a fixture, dispensing adhesive to the load frame and loadably placing the module s...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	JEFFREY A ZITZ, MICHAEL A GAYNES, EVAN G. COLGAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An assembly process for a heatsink attachment module for a chip packaging apparatus is provided and includes attaching a semiconductor chip to a substrate to form a module subassembly, placing a load frame and shim in a fixture, dispensing adhesive to the load frame and loadably placing the module subassembly chip face down in the fixture.