A polycrystalline superhard body comprising polycrystalline diamond (PCD)

A polycrystalline super hard construction 20, such as a cutting element for a drill bit, comprising a body of polycrystalline diamond (PCD) material 22 and a plurality of interstitial regions between inter-bonded diamond grains forming the polycrystalline diamond material is described. The body of P...

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Bibliographische Detailangaben
Hauptverfasser:	CLEMENT DAVID VAN DER RIET, NEDRET CAN
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE APPARATUS THEREFOR CASTING CHEMISTRY CRYSTAL GROWTH EARTH DRILLING EARTH DRILLING, e.g. DEEP DRILLING FIXED CONSTRUCTIONS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY MINING OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR ASLURRY OF MINERALS FROM WELLS PERFORMING OPERATIONS POWDER METALLURGY PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE REFINING BY ZONE-MELTING OF MATERIAL SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE SINGLE-CRYSTAL-GROWTH TRANSPORTING UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	A polycrystalline super hard construction 20, such as a cutting element for a drill bit, comprising a body of polycrystalline diamond (PCD) material 22 and a plurality of interstitial regions between inter-bonded diamond grains forming the polycrystalline diamond material is described. The body of PCD material 22 comprising a working surface 34 positioned along an outside portion of the body. A first region is substantially free of a solvent/catalysing material D, and a second region H remote from the working surface, 34 that includes solvent/ catalysing material in a plurality of the interstitial regions; and a substrate attached to the second region along an interface 30. The interface between H and D 50, or the interface 24 may be non-planar. The first region may be between 20 microns to 200 microns at one or more points along the interface with the substrate.