A tin-indium-zinc solder
A solder composition for glass which comprises (by weight): 30-60 % indium, 0.01-11.0 % zinc, optionally 0.1-3.0 % copper, optionally 0.01-0.5 % manganese, optionally 0.01-0.5 % nickel, with the balance being tin. A preferred composition is (by weight): 30 % indium, 0.01 zinc and the balance tin. Th...
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| creator | HONG NHO JOO SEUNG KYU KIM TAE SEUNG LEE JOO DONG LEE SUN MYUNG LEE HYUN CHAE JUNG HAE WON JEONG HYUN DAL PARK HO JUNE YOON MIN HO BAK |
| description | A solder composition for glass which comprises (by weight): 30-60 % indium, 0.01-11.0 % zinc, optionally 0.1-3.0 % copper, optionally 0.01-0.5 % manganese, optionally 0.01-0.5 % nickel, with the balance being tin. A preferred composition is (by weight): 30 % indium, 0.01 zinc and the balance tin. The composition can be in the form of a paste, ball, bar, wire, bump, plate, powder, pellet, ribbon, washer or ring and can be used to solder a terminal onto an electrode formed on a vehicle window. |
| format | Patent |
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A preferred composition is (by weight): 30 % indium, 0.01 zinc and the balance tin. The composition can be in the form of a paste, ball, bar, wire, bump, plate, powder, pellet, ribbon, washer or ring and can be used to solder a terminal onto an electrode formed on a vehicle window.</description><language>eng</language><subject>ALLOYS ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; FERROUS OR NON-FERROUS ALLOYS ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140219&DB=EPODOC&CC=GB&NR=2505030A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140219&DB=EPODOC&CC=GB&NR=2505030A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HONG NHO JOO</creatorcontrib><creatorcontrib>SEUNG KYU KIM</creatorcontrib><creatorcontrib>TAE SEUNG LEE</creatorcontrib><creatorcontrib>JOO DONG LEE</creatorcontrib><creatorcontrib>SUN MYUNG LEE</creatorcontrib><creatorcontrib>HYUN CHAE JUNG</creatorcontrib><creatorcontrib>HAE WON JEONG</creatorcontrib><creatorcontrib>HYUN DAL PARK</creatorcontrib><creatorcontrib>HO JUNE YOON</creatorcontrib><creatorcontrib>MIN HO BAK</creatorcontrib><title>A tin-indium-zinc solder</title><description>A solder composition for glass which comprises (by weight): 30-60 % indium, 0.01-11.0 % zinc, optionally 0.1-3.0 % copper, optionally 0.01-0.5 % manganese, optionally 0.01-0.5 % nickel, with the balance being tin. A preferred composition is (by weight): 30 % indium, 0.01 zinc and the balance tin. The composition can be in the form of a paste, ball, bar, wire, bump, plate, powder, pellet, ribbon, washer or ring and can be used to solder a terminal onto an electrode formed on a vehicle window.</description><subject>ALLOYS</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBwVCjJzNPNzEvJLM3VrcrMS1Yozs9JSS3iYWBNS8wpTuWF0twM8m6uIc4euqkF-fGpxQWJyal5qSXx7k5GpgamBsYGjsaEVQAASRwg8g</recordid><startdate>20140219</startdate><enddate>20140219</enddate><creator>HONG NHO JOO</creator><creator>SEUNG KYU KIM</creator><creator>TAE SEUNG LEE</creator><creator>JOO DONG LEE</creator><creator>SUN MYUNG LEE</creator><creator>HYUN CHAE JUNG</creator><creator>HAE WON JEONG</creator><creator>HYUN DAL PARK</creator><creator>HO JUNE YOON</creator><creator>MIN HO BAK</creator><scope>EVB</scope></search><sort><creationdate>20140219</creationdate><title>A tin-indium-zinc solder</title><author>HONG NHO JOO ; SEUNG KYU KIM ; TAE SEUNG LEE ; JOO DONG LEE ; SUN MYUNG LEE ; HYUN CHAE JUNG ; HAE WON JEONG ; HYUN DAL PARK ; HO JUNE YOON ; MIN HO BAK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_GB2505030A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>ALLOYS</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>HONG NHO JOO</creatorcontrib><creatorcontrib>SEUNG KYU KIM</creatorcontrib><creatorcontrib>TAE SEUNG LEE</creatorcontrib><creatorcontrib>JOO DONG LEE</creatorcontrib><creatorcontrib>SUN MYUNG LEE</creatorcontrib><creatorcontrib>HYUN CHAE JUNG</creatorcontrib><creatorcontrib>HAE WON JEONG</creatorcontrib><creatorcontrib>HYUN DAL PARK</creatorcontrib><creatorcontrib>HO JUNE YOON</creatorcontrib><creatorcontrib>MIN HO BAK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HONG NHO JOO</au><au>SEUNG KYU KIM</au><au>TAE SEUNG LEE</au><au>JOO DONG LEE</au><au>SUN MYUNG LEE</au><au>HYUN CHAE JUNG</au><au>HAE WON JEONG</au><au>HYUN DAL PARK</au><au>HO JUNE YOON</au><au>MIN HO BAK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>A tin-indium-zinc solder</title><date>2014-02-19</date><risdate>2014</risdate><abstract>A solder composition for glass which comprises (by weight): 30-60 % indium, 0.01-11.0 % zinc, optionally 0.1-3.0 % copper, optionally 0.01-0.5 % manganese, optionally 0.01-0.5 % nickel, with the balance being tin. A preferred composition is (by weight): 30 % indium, 0.01 zinc and the balance tin. The composition can be in the form of a paste, ball, bar, wire, bump, plate, powder, pellet, ribbon, washer or ring and can be used to solder a terminal onto an electrode formed on a vehicle window.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM |
| title | A tin-indium-zinc solder |
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