A tin-indium-zinc solder

A solder composition for glass which comprises (by weight): 30-60 % indium, 0.01-11.0 % zinc, optionally 0.1-3.0 % copper, optionally 0.01-0.5 % manganese, optionally 0.01-0.5 % nickel, with the balance being tin. A preferred composition is (by weight): 30 % indium, 0.01 zinc and the balance tin. Th...

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Bibliographische Detailangaben
Hauptverfasser:	HONG NHO JOO, SEUNG KYU KIM, TAE SEUNG LEE, JOO DONG LEE, SUN MYUNG LEE, HYUN CHAE JUNG, HAE WON JEONG, HYUN DAL PARK, HO JUNE YOON, MIN HO BAK
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A solder composition for glass which comprises (by weight): 30-60 % indium, 0.01-11.0 % zinc, optionally 0.1-3.0 % copper, optionally 0.01-0.5 % manganese, optionally 0.01-0.5 % nickel, with the balance being tin. A preferred composition is (by weight): 30 % indium, 0.01 zinc and the balance tin. The composition can be in the form of a paste, ball, bar, wire, bump, plate, powder, pellet, ribbon, washer or ring and can be used to solder a terminal onto an electrode formed on a vehicle window.