Heatsink for a PCB with channels accepting edges of the PCB preferably in a cut-out

A heatsink for mounting on a printed circuit board (PCB) has a first face for mounting electronic components and a second face opposite the first face for heat dissipation via fins etc. The heatsink has at least one channel, but preferably more, for receiving parts of the PCB such a finger 409 and e...

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1. Verfasser:	RHYS MARC OWEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	RHYS MARC OWEN
description	A heatsink for mounting on a printed circuit board (PCB) has a first face for mounting electronic components and a second face opposite the first face for heat dissipation via fins etc. The heatsink has at least one channel, but preferably more, for receiving parts of the PCB such a finger 409 and edges (405 fig 4). When assembled, the component mounting surface faces in substantially the same direction as a first face of the PCB that may carry components, such a s package 501, and the heat dissipating surface faces in substantially the same direction as the second opposite face of the PCB. Preferably the heatsink is positioned at least partially within a cutout of the PCB (see figure 4), and most preferably a fastener 507 can connect the component (via hole 503) and the PCB (via hole 411 in the finger) together. Figures 6 and 7 show top and bottom depictions of the assembly of component heatsink and PCB.
format	Patent
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When assembled, the component mounting surface faces in substantially the same direction as a first face of the PCB that may carry components, such a s package 501, and the heat dissipating surface faces in substantially the same direction as the second opposite face of the PCB. Preferably the heatsink is positioned at least partially within a cutout of the PCB (see figure 4), and most preferably a fastener 507 can connect the component (via hole 503) and the PCB (via hole 411 in the finger) together. 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When assembled, the component mounting surface faces in substantially the same direction as a first face of the PCB that may carry components, such a s package 501, and the heat dissipating surface faces in substantially the same direction as the second opposite face of the PCB. Preferably the heatsink is positioned at least partially within a cutout of the PCB (see figure 4), and most preferably a fastener 507 can connect the component (via hole 503) and the PCB (via hole 411 in the finger) together. Figures 6 and 7 show top and bottom depictions of the assembly of component heatsink and PCB.</abstract><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	Heatsink for a PCB with channels accepting edges of the PCB preferably in a cut-out
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