Heatsink for a PCB with channels accepting edges of the PCB preferably in a cut-out

A heatsink for mounting on a printed circuit board (PCB) has a first face for mounting electronic components and a second face opposite the first face for heat dissipation via fins etc. The heatsink has at least one channel, but preferably more, for receiving parts of the PCB such a finger 409 and e...

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Bibliographische Detailangaben
1. Verfasser: RHYS MARC OWEN
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A heatsink for mounting on a printed circuit board (PCB) has a first face for mounting electronic components and a second face opposite the first face for heat dissipation via fins etc. The heatsink has at least one channel, but preferably more, for receiving parts of the PCB such a finger 409 and edges (405 fig 4). When assembled, the component mounting surface faces in substantially the same direction as a first face of the PCB that may carry components, such a s package 501, and the heat dissipating surface faces in substantially the same direction as the second opposite face of the PCB. Preferably the heatsink is positioned at least partially within a cutout of the PCB (see figure 4), and most preferably a fastener 507 can connect the component (via hole 503) and the PCB (via hole 411 in the finger) together. Figures 6 and 7 show top and bottom depictions of the assembly of component heatsink and PCB.