Sliding element with a copper-based alloy layer

A sliding element comprises a steel backing layer and a copper-based sliding layer which contains (by mass): 10-30% Bi, 0.5-5% of an inorganic particles, optionally 0.5-5% Sn, optionally 0.1-10% in total Ni, Fe, P and Ag, with the balance being Cu and impurities. The inorganic particles have an aver...

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Bibliographische Detailangaben
Hauptverfasser: TAKUO IMAI, KENTARO TUJIMOTO, KOUJI ZUSI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A sliding element comprises a steel backing layer and a copper-based sliding layer which contains (by mass): 10-30% Bi, 0.5-5% of an inorganic particles, optionally 0.5-5% Sn, optionally 0.1-10% in total Ni, Fe, P and Ag, with the balance being Cu and impurities. The inorganic particles have an average size of 1-5 microns and a density of 70-130 % of that of the bismuth. The bismuth forms isotropically distributed particles of average size 2-15 microns in the copper alloy. Suitable inorganic particles are carbides such as NbC, Mo2C, WC-TiC, WC-TiC-TaC, nitrides such as ZrN, Mo2N, NbN, silicides such as TaSi2, WSi2and borides such as MoB and TaB2. The sliding element can have a copper-based overlay layer on top of the copper-based sliding layer.