Improved form c relay and package using same

Improved form c relay and package using same

The improved reed relay package (224) provides a "pseudo" Form C relay (200) that includes two Form A relays (206a, 206b) with at least one bridge filter element (202) electrically interconnecting the signal outputs (204a, 204b) thereof to reduce stub capacitance and improve RF performance...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MARK E TITTERINGTON, TRAVIS S ELLIS, STEPHEN DAY
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SWITCHES
ELECTRICITY
EMERGENCY PROTECTIVE DEVICES
RELAYS
SELECTORS
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Beschreibung
Zusammenfassung:The improved reed relay package (224) provides a "pseudo" Form C relay (200) that includes two Form A relays (206a, 206b) with at least one bridge filter element (202) electrically interconnecting the signal outputs (204a, 204b) thereof to reduce stub capacitance and improve RF performance. As a result, the reed relay package (224) can operate at very high frequencies, such as 18 GHz and higher. Also, vias (262) can be provided through the support substrate (228) to simulate a grounded co-planar waveguide and RF shields (254) profiled with cut-outs to better simulate a 50 ohm impedance environinent throughout the path of the signal line.