Thermally stable polycrystalline diamond materials,cutting elements incorporating the same and bits incorporating such cutting elements

A cutting element is provided including a substrate and a TSP material layer over the substrate. The TSP material layer includes at least a property having a value that varies through the layer.

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: MADAPUSI KESHAVAN
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A cutting element is provided including a substrate and a TSP material layer over the substrate. The TSP material layer includes at least a property having a value that varies through the layer.