Thermally stable polycrystalline diamond materials,cutting elements incorporating the same and bits incorporating such cutting elements
A cutting element is provided including a substrate and a TSP material layer over the substrate. The TSP material layer includes at least a property having a value that varies through the layer.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A cutting element is provided including a substrate and a TSP material layer over the substrate. The TSP material layer includes at least a property having a value that varies through the layer. |
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